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[] Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s, CPU1: Skylake-F CPU supported.
[] Intel® C624
[]  Up to 2TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
[]  3 PCI-E 3.0 x16,4 PCI-E 3.0 x8,M.2 Interface: 2 PCI-E 3.0 x4,M.2 Form Factor: 22110,M.2 Key: M-Key (RAID 0,1 support)
[]  1 VGA port
[]  Intel® C624 controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
[]  Dual LAN with 10GBase-T with Intel® X557

SKU: C624A16T
Call for pricing(800-664-8917)
Product specifications
Processor
• Intel® Xeon® Scalable Processors
• Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
• CPU1: Skylake-F CPU supported.
Chipset Intel® C624
Memory
• Up to 2TB DDR4-2666MHz Memory in 16 DIMM slots
• Memory Type 2666/2400/2133MHz ECC DDR4 RDIMM, LRDIM
On-Board Devices
• 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
• IPMI
• Dual LAN with 10GBase-T with Intel® X557
Expansion
• 3 PCI-E 3.0 x16,
• 4 PCI-E 3.0 x8
• M.2 : 2 PCI-E 3.0 x4
I/O Ports
• 10 SATA3 (6Gbps) ports
• 2 RJ45 10GBase-T ports
• 7 USB 3.0 ports (4 rear + 2 headers + 1 Type A)
• 1 VGA port
• 2 COM Ports (1 rear, 1 header)
• TPM Header
Systemboard
E-ATX 12" x 13"
Chassis 2U chassis:
• Dimensions: 17.2" (437mm) x 3.5" (89mm) x 25.5" (648mm)
• Weight: 52 lbs (23.6kg)
• 740W (1+1) Redundant high-efficiency power supply with PMBus
BIOS AMI UEFI
Environment
• Operating Temperature: 0 to +55 C
• Non operating temperature: -20 to +70 C
• Vibration - Operating: 9.8 m/s2(1.0G) 5 to 500Hz
• Vibration - Non operating: 49 m/s2(5.0G) 15 to 500Hz
• Shock - Operating: 3,920 m/s2 (400G) 2ms
• Shock - Non-Operating: 8,820 m/s2 (900G) 1ms
• Operating Relative Humidity: 8% to 90% (non-condensing)
• Non-operating Relative Humidity: 5% to 95% (non-condensing)
• MTBF: 50,000 Hours
• RoHS Compliance
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