| Processor | • Intel® Xeon® Scalable Processors• Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s• CPU1: Skylake-F CPU supported. |
| Chipset | Intel® C622 |
| Memory | • Up to 2TB DDR4-2666MHz Memory in 16 DIMM slots• Memory Type 2666/2400/2133MHz ECC DDR4 RDIMM, LRDIM |
| On-Board Devices | • 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10• IPMI• Dual LAN with 10GBase-T with Intel® X722 + X557 |
| Expansion | • 4 PCI-E 3.0 x16,• 2 PCI-E 3.0 x8• M.2 : PCI-E 3.0 x4 |
| I/O | • 14 SATA3 (6Gbps) ports• RJ45 Shared IPMI LAN port• 5 USB 3.0 ports (2 rear + 2 headers + 1 Type A)• 4 USB 2.0 ports (2 rear + 2 headers)• 1 VGA port• 2 COM Ports (1 rear, 1 header)• TPM Header |
| Systemboard | • E-ATX 12" x 13" |
| Chassis | 2U chassis:• Dimensions: 17.2" (437mm) x 3.5" (89mm) x 25.5" (648mm)• Weight: 52 lbs (23.6kg)• 740W (1+1) Redundant high-efficiency power supply with PMBus |
| BIOS | AMI UEFI |
| Environment | • Operating Temperature: 0 to +55 C• Non operating temperature: -20 to +70 C• Vibration - Operating: 9.8 m/s2(1.0G) 5 to 500Hz• Vibration - Non operating: 49 m/s2(5.0G) 15 to 500Hz• Shock - Operating: 3,920 m/s2 (400G) 2ms• Shock - Non-Operating: 8,820 m/s2 (900G) 1ms• Operating Relative Humidity: 8% to 90% (non-condensing)• Non-operating Relative Humidity: 5% to 95% (non-condensing)• MTBF: 50,000 Hours• RoHS Compliance |
