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PolyServer C612A16T-E11

Dual Socket P Intel® Xeon, 10 SATA3-6, 2 Gigabit LAN, 16 DDR4 up to 2TB, 11 Slots
Featured Highlights
Dual Socket P Intel® Xeon® Scalable Processors.
Up to 2TB Registered ECC DDR4, 16x DIMM slots.
2 PCI-E 3.0 x16, 8 PCI-E 3.0 x8, 1 PCI-E 3.0 x4
Dual LAN with Intel X550 10GBase-T Ethernet Controller
Intel C621 controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
M.2 Interface: 1 PCI-E 3.0 x4
5 USB 3.0 ports, 4 USB 2.0 ports
SKU: C612A16T-E11
Product specifications
Attribute nameAttribute value
Processor
• Intel® Xeon® Scalable Processors
• Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
Chipset
• Intel® C621
Memory
• Up to 2TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
• 2666/2400/2133MHz ECC DDR4 RDIMM, LRDIMM
On-Board Devices
• Intel® C621 controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
• IPMI:ASPEED AST2500
• Dual LAN with Intel® X550 10GBase-T Ethernet Controller
• Graphics:Aspeed AST2500 BMC
Expansion
• 2 PCI-E 3.0 x16
• 8 PCI-E 3.0 x8
• 1 PCI-E 3.0 x4 (in x8 slot) Or 4 PCI-E 3.0 x16 and 4 PCI-E 3.0 x8 and 1 PCI-E 3.0 x4 (in x8 slot)
• M.2 Interface: 1 PCI-E 3.0 x4
• Form Factor: 2280, 22110
• Key: M-Key
I/O
• 10 SATA3 (6Gbps) port
• 2 RJ45 10GBase-T ports
• 4 USB 2.0 ports (2 rear + 1 header)
• 5 USB 3.0 ports (2 rear + 2 headers + 1 Type A)
• 1 VGA D-Sub Connector port
• 2 COM Ports (1 rear, 1 header)
• 1 TPM Header
Systemboard
Proprietary 15.12" x 13.2"
Chassis4U chassis:
• Dimensions: 17.2" (437 mm)x 5.2" (132 mm) x 5.5" (647 mm)
• Weight: 75 lbs (34.02 kg)
• 980W Redundant High-efficiency Platinum Level (94%+) Power Supplies
BIOS
• AMI 32Mb SPI Flash ROM
Environment
• Operating Temperature: 0 to +55 C
• Non operating temperature: -20 to +70 C
• Vibration - Operating: 9.8 m/s2(1.0G) 5 to 500Hz
• Vibration - Non operating: 49 m/s2(5.0G) 15 to 500Hz
• Shock - Operating: 3,920 m/s2 (400G) 2ms
• Shock - Non-Operating: 8,820 m/s2 (900G) 1ms
• Operating Relative Humidity: 8% to 90% (non-condensing)
• Non-operating Relative Humidity: 5% to 95% (non-condensing)
• MTBF: 50,000 Hours
• RoHS Compliance
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Product specifications
Attribute nameAttribute value
Processor
• Intel® Xeon® Scalable Processors
• Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
Chipset
• Intel® C621
Memory
• Up to 2TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
• 2666/2400/2133MHz ECC DDR4 RDIMM, LRDIMM
On-Board Devices
• Intel® C621 controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
• IPMI:ASPEED AST2500
• Dual LAN with Intel® X550 10GBase-T Ethernet Controller
• Graphics:Aspeed AST2500 BMC
Expansion
• 2 PCI-E 3.0 x16
• 8 PCI-E 3.0 x8
• 1 PCI-E 3.0 x4 (in x8 slot) Or 4 PCI-E 3.0 x16 and 4 PCI-E 3.0 x8 and 1 PCI-E 3.0 x4 (in x8 slot)
• M.2 Interface: 1 PCI-E 3.0 x4
• Form Factor: 2280, 22110
• Key: M-Key
I/O
• 10 SATA3 (6Gbps) port
• 2 RJ45 10GBase-T ports
• 4 USB 2.0 ports (2 rear + 1 header)
• 5 USB 3.0 ports (2 rear + 2 headers + 1 Type A)
• 1 VGA D-Sub Connector port
• 2 COM Ports (1 rear, 1 header)
• 1 TPM Header
Systemboard
Proprietary 15.12" x 13.2"
Chassis4U chassis:
• Dimensions: 17.2" (437 mm)x 5.2" (132 mm) x 5.5" (647 mm)
• Weight: 75 lbs (34.02 kg)
• 980W Redundant High-efficiency Platinum Level (94%+) Power Supplies
BIOS
• AMI 32Mb SPI Flash ROM
Environment
• Operating Temperature: 0 to +55 C
• Non operating temperature: -20 to +70 C
• Vibration - Operating: 9.8 m/s2(1.0G) 5 to 500Hz
• Vibration - Non operating: 49 m/s2(5.0G) 15 to 500Hz
• Shock - Operating: 3,920 m/s2 (400G) 2ms
• Shock - Non-Operating: 8,820 m/s2 (900G) 1ms
• Operating Relative Humidity: 8% to 90% (non-condensing)
• Non-operating Relative Humidity: 5% to 95% (non-condensing)
• MTBF: 50,000 Hours
• RoHS Compliance