Processor | • Intel® Xeon® Scalable Processors.• Dual Socket P (LGA 3647) supported, CPU TDP support Up to 140W, 2 UPI up to 10.4 GT/s |
Chipset | Intel® C621 |
Memory | • Up to 512GB Registered ECC RDIMM, DDR4-2666MHz; Up to 1TB Registered ECC LRDIMM, in 8 DIMM slots• 2666/2400/2133MHz ECC DDR4 RDIMM, LRDIMM |
On-Board Devices | • Intel® C621 controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10• ASPEED AST2500• Aspeed AST2500 BMC |
Network | • Dual LAN with Lewisburg Marvell 88E1512 PHY |
Expansion Slot | • 2 PCI-E 3.0 x16• 3 PCI-E 3.0 x8• 1 PCI-E 3.0 x4 (in x8 slot) |
I/O | • 10 SATA3 (6Gbps) port• 2 RJ45 Gigabit Ethernet LAN ports• 4 USB 2.0 ports (2 rear + 2 headers)• 3 USB 3.0 ports (2 headers + 1 Type A)• 1 VGA port• 1 COM Port (1 header)• 1 TPM Header |
Systemboard | • ATX 12.076" x 10.15" |
Chassis | • TS900W 9-Bay ATX Tower• 9 external 5.25" with Easy Front Removable Tray• 210 (W) x 510 (H) x 549 (D) mm, 8.26 (W) x 20 (H) x 21.6 (D) inch |
BIOS | AMI UEFI |
Environment | • Operating Temperature: 0 to +55 C• Non operating temperature: -20 to +70 C• Vibration - Operating: 9.8 m/s2(1.0G) 5 to 500Hz• Vibration - Non operating: 49 m/s2(5.0G) 15 to 500Hz• Shock - Operating: 3,920 m/s2 (400G) 2ms• Shock - Non-Operating: 8,820 m/s2 (900G) 1ms• Operating Relative Humidity: 8% to 90% (non-condensing)• Non-operating Relative Humidity: 5% to 95% (non-condensing)• MTBF: 50,000 Hours• RoHS Compliance |